Sto-Resol insulation board

STO SE & Co. KGaA

Description

Thermal insulation board made of phenolic resin rigid foam according to EN 13166

Depending on the insulation thickness, the rated value of the thermal conductivity is very low at λ: 0.021-0.022 W/(mk). This makes it possible to implement slender constructions with good thermal insulation. Window reveals and door reveals can thus be kept very slim. This makes it possible to achieve slim optics with the greatest possible incidence of light.

More Over

External use

  • as an insulating board in the StoTherm Resol composite thermal insulation system
  • for dry and flat substrates,
  • not suitable in the base area and in the ground

Technical Information

Properties

  • Nominal value of thermal conductivity λD: 0.020 W/(m*K)
  • Eurofire class C-s2, d0 according to EN 13501-1
  • fleece-laminated
  • according to the specifications of EN 13166

Notes

Design

value of thermal conductivity λ: 0.021 - 0.022 W/(m*K)

 

Format/size

edges: blunt (2 - 20 cm), 120 x 40 cm

Downloads

Used in Projects