Thermal insulation board made of phenolic resin rigid foam according to EN 13166
Depending on the insulation thickness, the rated value of the thermal conductivity is very low at λ: 0.021-0.022 W/(mk). This makes it possible to implement slender constructions with good thermal insulation. Window reveals and door reveals can thus be kept very slim. This makes it possible to achieve slim optics with the greatest possible incidence of light.