STEICO universal

STEICO SE

Description

The heat-insulating sub-roof and wall building board for new buildings.

More Over

Ecological, production in the wet process
Excellent heat protection in summer
Reduces structural thermal bridges
be used in combination with STEICO blown-in insulation from a panel thickness of 35 mm
Interlocked underlay in accordance with ZVDH
Sub-roof panel type: UDP-A, suitable as a temporary cover
Environmentally friendly and recyclable like wood
No additional roofing membrane necessary from a roof pitch of ≥ 16° No additional roofing membrane necessary

Technical Information

Produced and monitored in accordance with: DIN EN 13171, DIN EN 14964
Panel marking: WF – EN 13171 – T5 – DS (70,-) 2 – CS (10 \ Y)200 –TR30 – WS1,0 – AFr100, EN-14964-IL
Reaction to fire (RTF) in accordance with DIN EN 13501-1: E
Nominal thermal conductivity λD [W/(m*K)]: 0.048
Nominal thermal resistance [(m²*K)/W]: 0.45(22) / 0.70(35) / 1.25(60)
Bulk density [kg/m³]: approx. 270
Water vapour diffusion resistance coefficient μ: 5
sd value [m]: 0.11(22) / 0.18(35) / 0.30(60)
Classification ZVDH: Class 3 to 5
Outdoor weathering: up to 4 weeks
Short-term water absorption [kg/m²]: ≤ 1.0
Specific heat capacity c [J/(kg*K)]: 2,100
Compressive stress at 10% compression δ10 [N/mm²]: 0.20
Compressive strength [kPa]: 200
Tensile strength perpendicular to the board plane [kPa]: ≥ 30
UDP-A: Meets classes 3 to 5 according to ZVDH Technical rules
Input materials: wood fibre, aluminium sulphate, paraffin, layer bonding
Waste key (EAK/AVV): 030105/170201, disposal such as wood and wood-based materials
Design value thermal conductivity λB DE [W/(m*K)]: 0.050
Design value thermal conductivity λr AT [W/(m*K)]: 0.053
Design value thermal conductivity according to SIA CH [W/(m*K)]: 0.048
Fire behavior group according to VKF Fire protection guideline: RF3

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