STEICO universal

STEICO SE

Description

The heat-insulating sub-roof and wall building board for new buildings.

More Over

  • Ecological, production in the wet process
  • Excellent heat protection in summer
  • Reduces structural thermal bridges
  • Can
  • be used in combination with STEICO blown-in insulation from a panel thickness of 35 mm
  • Interlocked underlay in accordance with ZVDH
  • Sub-roof panel type: UDP-A, suitable as a temporary cover
  • Environmentally friendly and recyclable like wood
  • No additional roofing membrane necessary from a roof pitch of ≥ 16° No additional roofing membrane necessary

Technical Information

  • Produced and monitored in accordance with: DIN EN 13171, DIN EN 14964
  • Panel marking: WF – EN 13171 – T5 – DS (70,-) 2 – CS (10 \ Y)200 –TR30 – WS1,0 – AFr100, EN-14964-IL
  • Reaction to fire (RTF) in accordance with DIN EN 13501-1: E
  • Nominal thermal conductivity λD [W/(m*K)]: 0.048
  • Nominal thermal resistance [(m²*K)/W]: 0.45(22) / 0.70(35) / 1.25(60)
  • Bulk density [kg/m³]: approx. 270
  • Water vapour diffusion resistance coefficient μ: 5
  • sd value [m]: 0.11(22) / 0.18(35) / 0.30(60)
  • Classification ZVDH: Class 3 to 5
  • Outdoor weathering: up to 4 weeks
  • Short-term water absorption [kg/m²]: ≤ 1.0
  • Specific heat capacity c [J/(kg*K)]: 2,100
  • Compressive stress at 10% compression δ10 [N/mm²]: 0.20
  • Compressive strength [kPa]: 200
  • Tensile strength perpendicular to the board plane [kPa]: ≥ 30
  • UDP-A: Meets classes 3 to 5 according to ZVDH Technical rules
  • Input materials: wood fibre, aluminium sulphate, paraffin, layer bonding
  • Waste key (EAK/AVV): 030105/170201, disposal such as wood and wood-based materials
  • Design value thermal conductivity λB DE [W/(m*K)]: 0.050
  • Design value thermal conductivity λr AT [W/(m*K)]: 0.053
  • Design value thermal conductivity according to SIA CH [W/(m*K)]: 0.048
  • Fire behavior group according to VKF Fire protection guideline: RF3

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