With
a thermal conductivity of λ = 0.021-0.024 W/mK, phenolic resin foam has exceptionally good thermal insulation properties and is resistant to ageing and shape as well as diffusion-tight (μ = 25–35), provided that the insulation material is protected against moisture. Boron or phosphate compounds may be added to improve flame retardancy. Phenolic resin is resistant to acids, alkalis, UV radiation, pests, rot and mould. In the event of a fire, it does not drip or melt and develops only small amounts of smoke.
Delivery forms
Panels
Area of application
Phenolic resin insulation materials have a very fine, closed cell structure and offer a very high insulation performance. This minimizes the structural thickness in the thermal insulation composite system and slimmer outer walls are possible. Phenolic resin insulation boards can be used in façade insulation as part of a thermal insulation composite system in all areas, except for walls in contact with the ground and in splash water areas. The insulation board can be directly clad indoors with plaster cardboard, plaster, wallpaper, etc. and is easy to work with. The consideration of phenolic resin rigid foam is already of particular importance during the planning phase. Due to the high insulation performance, the wall thickness can be significantly minimized in new buildings – for example in a passive house. The so-called "embrasure effect" is reduced and more light enters the interior through the windows. In the thermal renovation of old buildings, the slim insulation can preserve the character of the building well and expensive conversion work (roof overhang, etc.) is avoided. The design of the insulation boards with stepped rebate minimizes the risk of thermal bridges.
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rot= Areas of application, grey= not possible
